2013 2nd International Conference on Mechanical
Properties of Materials and Information Technology (ICMPMIT 2013)
2013年第二届材料力学性能与信息技术国际学术研讨会
August 17-19, 2013,
Hong Kong
All accepted papers will be
published on international journal “Advanced Materials
Research ”
and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (ISTP), and other indexing services (See TTP's
Conference List). 本次会议所录用的文章全部由“Advanced
Materials Research ”期刊出版，并将被EI, ISTP检索。
ICMPMIT2011 has been indexed by EI Compendex.
首届ICMPMIT2011已全部被EI检索。
Paper
Submission due全文截稿时间:
June 20,
2013
Submission System投稿系统: https://www.easychair.org/conferences/?conf=icmpmit2013
初稿时，中文或英文投稿均可，但一旦录用后，所有文章需全部翻译成英文。
Contact: Email: icmpmit2013reg@xxxxxxx Tel:
(+86)15071193979 (+86)02787772193
欢迎您参与ICMPMIT2013!欢迎您的到香港来！