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[ EI, ISI and Scopus] 2013 International Conference on MEMS and Mechanics (MEMSM 2013)

2013 International Conference on MEMS and Mechanics


March 15-16,2013, Wuhan, China


MEMSM 2013 will be the most comprehensive Conference focused on the various aspects of advances in MEMS and Mechanics. Our Conference provides a chance for academic and industry professionals to discuss recent progress in the area of MEMS and Mechanics.

The goal of this Conference is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspect MEMS and Mechanics.

All accepted papers were published on Advanced Materials Research journal and have been indexed in EI Compendex, Thomson ISTP and Elsevier SCOPUS databases(See the detail)Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. Selected excellent papers will be published on international reputation journals.

MEMSM 2013 serves as good platforms for academics, researchers, and engineers to meet and exchange innovative ideas and information on all aspects of material technologies, MEMS and Mechatronics.

Topics of interest for submission include

(A) New Materials and Advanced Materials
(A1) Composites
(A2) Micro / Nano Materials 
(A3) Iron and Steel
(A4) Ceramic 
(A5) Metal alloy Materials 
(A6) Biomaterials
(A7) Optical/Electronic/Magnetic Materials
(A8) Building Materials 
(A9) New Energy Materials 
(A10) Environmental Friendly Materials
(A11) Biomaterials
(A12) Chemical Materials
(A13) Thin Films
(A14) Earthquake Resistant Structures, Materials and Design
(A15) Smart/Intelligent Materials/Intelligent Systems
(A16) Hydrogen and Fuel Cell Science, Engineering & Technology
(A17) New Functional Materials
(A18) Cryogenic Materials
(A19) Testing and Evaluation of Materials
(A20) Materials Physics and Chemistry
(A21) ToolingTesting and Evaluation of Materials
(A22) Material Design of Comupter Aided

(B) MEMS and Mechatronics
(B1) Mechatronics
(B2) Industrial Robotics and Automation
(B3) Machine Vision
(B4) Sensor Technology
(B5) Microelectronic Technology
(B6) Integrated Circuit Technology
(B7) Measure Control Technologies and Intelligent Systems
(B8) Transmission and Control of Fluid
(B9) Mechanical Control and Information Processing Technology
(B10) Embedded System
(B11) Advanced Forming Manufacturing and Equipment
(B12) NEMS/MEMS Technology and Equipment
(B13) Micro-Electronic Packaging Technology and Equipment
(B14) Advanced NC Techniques and Equipment
(B15) Power and Fluid Machinery
(B16) Energy Machinery and Equipment
(B17) Construction Machinery and Equipment

Important dates
Full paper dueJanuary 15 , 2013
Notification of acceptance2-3 weeks after submission
Final version dueBefore January 15, 2013

Paper Format: Paper format

The submission system is: https://www.easychair.org/conferences/?conf=memsm2013